Electronic device and manufacturing method thereof

The invention discloses an electronic device and a manufacturing method of the electronic device. The electronic device comprises a substrate, an edge lead, a first protective layer and a second protective layer. The substrate is provided with a first surface, a second surface and a side surface connected between the first surface and the second surface. A normal vector of the side surface is different from the first surface and also different from the second surface. The edge lead is disposed on the substrate and extends from the first surface to the second surface through the side surface. The first protection layer is disposed on the edge lead. The edge lead is clamped between the substrate and the first protection layer, and the edge lead and the first protection layer form an undercut structure. The second protective layer is disposed on the substrate and fills the undercut structure. 一种电子装置及电子装置的制造方法，电子装置包括基板、边缘导线、第一保护层以及第二保护层。基板具有第一表面、第二表面以及连接于第一表面与第二表面之间的侧表面。侧表面的法向量不同于第一表面也不同于第二表面。边缘导线配置于基板上，由第一表面经过侧表