SUBSTRATE TRANSFER APPARATUS AND SUBSTRATE TRANSFER METHOD

The invention provides a substrate transfer apparatus and a substrate transfer method. The substrate transfer apparatus includes: a non-conductive support with an upper surface that faces a substrate and supports the substrate; a mover that moves the support to transfer the substrate; a connector th...

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Bibliographische Detailangaben
Hauptverfasser:	TOCHIHARA TOHRU, KIYAMA HIDEKAZU, HASHIMA HITOSHI, MATSUSHITA MICHIAKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY NATURALLY-OCCURRING ELECTRICITY SEMICONDUCTOR DEVICES STATIC ELECTRICITY
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Beschreibung
Zusammenfassung:	The invention provides a substrate transfer apparatus and a substrate transfer method. The substrate transfer apparatus includes: a non-conductive support with an upper surface that faces a substrate and supports the substrate; a mover that moves the support to transfer the substrate; a connector that connects the support and the mover while being grounded; a conductive contact that is provided on the upper surface of the support, and supports the substrate in contact with a lower surface of the substrate such that the substrate is not brought into contact with the support; a strip-shaped conductive path that is provided to connect the contact and the connector, and a bent portion which is formed on the strip-shaped conductive path. The bent portion is formed such that an interval of the strip-shaped conductive path formed by the bent portion is at least twice a width of the strip-shaped conductive path. In the substrate transfer apparatus which makes the substrate to be grounded for eliminating electricity t