High-stability bonding and routing method for flip crystal applied to integrated circuit

The invention provides a high-stability bonding and routing method for a flip crystal applied an integrated circuit, belonging to the technical field of semiconductor packaging. The method comprises the following steps: detecting the mechanical strength of the crystal; thinning and scribing a wafer;...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YU ZHENG, YUE HUANHUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING
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