High-stability bonding and routing method for flip crystal applied to integrated circuit

The invention provides a high-stability bonding and routing method for a flip crystal applied an integrated circuit, belonging to the technical field of semiconductor packaging. The method comprises the following steps: detecting the mechanical strength of the crystal; thinning and scribing a wafer; allowing a first chip loader gripper to pick up a chip from the wafer and place the chip in a chip area of a slide glass base island; picking up the crystal from a braid by a second chip loader gripper, and placing the crystal in a crystal area by using chip mounting equipment; arranging chip bonding pads at the input end and the output end of the chip respectively, and arranging crystal bonding pads at the positive electrode and the negative electrode of the crystal respectively; and allowing the positive electrode of the crystal to be electrically connected with the input end of the chip through a gold wire and enabling the negative electrode of the crystal to be electrically connected with the output end of the