Laser processing equipment for substrate scribing

The invention discloses laser processing equipment for substrate scribing. The equipment comprises a rack, a laser head mounting plate is arranged at the top end of the front face of the rack, a plurality of laser heads are arranged at one side of the laser head mounting plate, an X-axis transplanti...

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Bibliographische Detailangaben
Hauptverfasser:	YANG SHENGRONG, SHEN MINGHAI, GU YANGYUAN, FANG LINGSHEN, DENG YUANGUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention discloses laser processing equipment for substrate scribing. The equipment comprises a rack, a laser head mounting plate is arranged at the top end of the front face of the rack, a plurality of laser heads are arranged at one side of the laser head mounting plate, an X-axis transplanting mechanism is arranged at one side of the interior of the rack, and a Y-axis transplanting mechanism is arranged at the other side of the interior of the rack; and a Z-axis high-precision linear motor transplanting mechanism is arranged between the X-axis transplanting mechanism and the Y-axis transplanting mechanism, a workpiece load support is arranged at the top end of the Z-axis high-precision linear motor transplanting mechanism, and a human-computer interface is arranged at one side of the top end of the rack. The equipment has the beneficial effects that the equipment can realize 0-2 [mu] m level contact between Z-axis glass and a substrate contact surface, can ensure that the precision of laser scribing i