Resin composition, cured molded article, fiber-reinforced plastic molding material, fiber-reinforced plastic, fiber-reinforced plastic laminated molded body, and methods for producing same
A resin composition contains a first resin and a second resin, and exhibits curability by thermal crosslinking, wherein the first resin is at least one selected from among a bifunctional epoxy resin having a weight average molecular weight of 4,000 or more, and a phenoxy resin, and the second resin...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A resin composition contains a first resin and a second resin, and exhibits curability by thermal crosslinking, wherein the first resin is at least one selected from among a bifunctional epoxy resin having a weight average molecular weight of 4,000 or more, and a phenoxy resin, and the second resin is a polycarbonate resin. The content ratio, by weight, of the first resin to the second resin (the first resin:the second resin) is preferably in the range of 9:1 to 2:8. Both the first resin and the second resin preferably have a bisphenol skeleton in a molecule.
一种树脂组合物,含有第一树脂与第二树脂且通过热交联而显示出硬化性,其中,第一树脂为选自重量平均分子量为4,000以上的二官能型环氧树脂、及苯氧树脂中的一种以上,第二树脂为聚碳酸酯树脂。第一树脂与第二树脂的含有比率(第一树脂:第二树脂)优选为以重量比计为9:1~2:8的范围内。第一树脂与第二树脂优选为均在分子内具有双酚骨架。 |
---|