Manufacturing method of aluminum substrate circuit board

The invention provides a manufacturing method for an aluminum substrate circuit board. The method comprises the following steps of: designing wires according to a circuit, and cutting raw materials of a conductive layer to form corresponding wires; designing a wire layout according to the circuit, and placing the cut wires on a bonding layer arranged on an aluminum-based bottom plate; and making one surface of the bonding layer connected with the wires and the other surface of the bonding layer connected with the aluminum-based bottom plate through a pressing process. Therefore, the manufacturing method of the aluminum substrate circuit board of the invention has the advantages of no need of etching and film stripping, no generation of waste water, no need of payment of treatment cost, high environmental friendliness, simple technological process, low engineering cost, short engineering delivery time and low production cost. According to the manufacturing method, a plurality of processing steps are reduced. 本