Hanging basket, and hole metallization method of circuit board
The invention provides a hanging basket, and a hole metallization method of a circuit board. The hanging basket comprises a frame body mechanism and a groove plate. The groove plate is arranged on the frame body mechanism, a storage groove is formed in the groove plate, the storage groove is used fo...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a hanging basket, and a hole metallization method of a circuit board. The hanging basket comprises a frame body mechanism and a groove plate. The groove plate is arranged on the frame body mechanism, a storage groove is formed in the groove plate, the storage groove is used for placing a circuit board, and the extension direction of the storage groove is not vertically intersected with the horizontal plane, so that the plane where the circuit board placed on the groove plate is located is not vertically intersected with the horizontal plane. According to the hanging basket, the hole metallization qualification rate and efficiency of the circuit board can be effectively improved.
本申请提供一种挂篮和线路板的孔金属化方法。上述的挂篮包括框体机构和槽板。槽板设置在框体机构上,槽板上开设有安置槽,安置槽用于置放线路板,安置槽的延伸方向与水平面非垂直相交,以使置放于槽板上的线路板所在的平面与水平面非垂直相交。上述的挂篮能有效提高线路板的孔金属化合格率和效率。 |
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