Inductor and power supply module
The invention discloses an inductor and a power supply module. The inductor comprises an insulating body and a conductor. The insulating body has a top surface and a bottom surface. The conductor comprises two pin parts and a heat dissipation part. A part of each pin part is exposed out of the botto...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses an inductor and a power supply module. The inductor comprises an insulating body and a conductor. The insulating body has a top surface and a bottom surface. The conductor comprises two pin parts and a heat dissipation part. A part of each pin part is exposed out of the bottom surface, and parts of the two pin parts exposed out of the insulating body are used for being fixed on a circuit board. The heat dissipation part is connected with the two pin parts, and the heat dissipation part is exposed out of the top surface; the heat dissipation part is used for being connected with an external heat dissipation component. When the inductor is fixed to the circuit board through the two pin parts exposed out of the bottom surface, the two pin parts and the bottom surface jointly form a containing space, and the containing space is used for containing a chip arranged on the circuit board. When the heat dissipation part is connected with the external heat dissipation component, heat energy gene |
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