Rigid-flex board manufacturing process
The invention discloses a rigid-flex board manufacturing process, which comprises the steps of S1, conducting pretreatment, specifically, pasting a high-temperature-resistant PI film on any surface of a PP board, then forming a semi-laser PI film and a laser hole on the PP board, finally tearing off...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a rigid-flex board manufacturing process, which comprises the steps of S1, conducting pretreatment, specifically, pasting a high-temperature-resistant PI film on any surface of a PP board, then forming a semi-laser PI film and a laser hole on the PP board, finally tearing off the high-temperature-resistant PI film in a waste area, and reserving a flexible board area needing to be isolated; S2, stacking boards, specifically, stacking the pretreated copper foil, PP board and flexible board in sequence, wherein one side of the PI film on the surface of the PP board is attached to a protective film on the surface of the flexible board; S3, conducting board pressing; S4, drilling holes; S5, performing copper plating; S6, carrying out etching; S7, carrying out semi-radium processing; S8, removing waste materials; and S9, after ink printing, entering a subsequent process. According to the invention, a PP and high-temperature-resistant PI film laser half-cutting mode is adopted, and the PP can |
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