ADHESIVE FILM FOR CIRCUIT CONNECTION AND METHOD FOR PRODUCING SAME, METHOD FOR PRODUCING CIRCUIT CONNECTED STRUCTURE, AND ADHESIVE FILM HOUSING SET

One aspect of the present invention is an adhesive film for circuit connection, provided with: a first adhesive layer containing conductive particles and a second adhesive layer disposed on the first adhesive layer, wherein the shortest distance from the surface on the first adhesive layer side of the adhesive film to the surface of the conductive particles is greater than 0 [mu]m but 1 [mu]m or less; the ratio of the thickness of the first adhesive layer to the average particle diameter of the conductive particles is 10 to 80%; and the ratio of the thickness of the second adhesive layer to the total thickness of the first adhesive layer and the second adhesive layer is less than 96%. 本发明的一方面为一种电路连接用黏合剂膜，其具备：含有导电粒子的第一黏合剂层及层叠于第一黏合剂层上的第二黏合剂层，从黏合剂膜的第一黏合剂层侧的表面至导电粒子的表面的最短距离超过0μm且为1μm以下，第一黏合剂层的厚度相对于导电粒子的平均粒径的比为10％以上且80％以下，第二黏合剂层的厚度相对于第一黏合剂层及第二黏合剂层的合计厚度的比小于96％。