Printed circuit board, printed assembly board and electronic equipment

The invention relates to a printed circuit board, a printed assembly board and electronic equipment, and the printed circuit board comprises an insulating substrate, an operation part bonding pad printed on the insulating substrate, a ground plane printed on the insulating substrate, and a protection layer covering the ground plane. The operation part bonding pad is a bonding pad used for being connected with an operation part receiving external triggering; and the protection layer forms a window beside the operation part bonding pad, so that the ground plane is exposed outwards at the window. 本公开涉及一种印制电路板、印制装配板及电子设备，该印制电路板包括绝缘基板、印制在所述绝缘基板上的操作部焊盘、印制在所述绝缘基板上的地平面、及覆盖在所述地平面上的防护层，其中，所述操作部焊盘为用于连接接受外部触发的操作部件的焊盘；所述防护层在所述操作部焊盘的旁侧形成开窗，以使得所述地平面在所述开窗处向外露出。