CONNECTION STRUCTURE, CIRCUIT CONNECTION MEMBER AND ADHESIVE COMPOSITION
The invention provides a connection structure, a circuit connection member, and an adhesive composition. A connection structure is provided with: a first circuit member having a first circuit electrode; a second circuit member having a second circuit electrode; and a circuit connection member that i...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a connection structure, a circuit connection member, and an adhesive composition. A connection structure is provided with: a first circuit member having a first circuit electrode; a second circuit member having a second circuit electrode; and a circuit connection member that is provided between the first circuit member and the second circuit member and electrically connects the first circuit electrode and the second circuit electrode to each other. The linear thermal expansion amount L (t) of the circuit connection member at a temperature t satisfies the condition dL (t)/dt < 0 when t = 30 DEG C to 12 DEG C.
本发明提供连接结构体、电路连接构件和粘接剂组合物。一种连接结构体,其具备:具有第一电路电极的第一电路构件;具有第二电路电极的第二电路构件;以及设置于第一电路构件和第二电路构件之间且将第一电路电极和第二电路电极相互电连接的电路连接构件,电路连接构件在温度t时的线热膨胀量L(t)满足在t=30℃~12℃的至少任一者时dL(t)/dt<0的条件。 |
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