SEMICONDUCTOR DEVICE

A semiconductor device may include a substrate, a first semiconductor chip buried in the substrate, a first antenna pattern, a second antenna pattern, and outer terminals. A bottom surface of the substrate may include first and second regions spaced apart from each other. The first semiconductor chip may have a first active surface that is directed to the top surface of a core portion of the substrate. The first antenna pattern may be provided on the top surface of the substrate and electrically connected to the first semiconductor chip. The outer terminals may be provided on the first region of the bottom surface of the substrate, and the second antenna pattern may be provided on the second region of the bottom surface of the substrate. 一种半导体设备可以包括：基板、掩埋在基板中的第一半导体芯片、第一天线图案、第二天线图案和外部端子。基板的底表面可以包括彼此间隔开的第一区和第二区。第一半导体芯片可以具有第一有源表面，第一有源表面朝向基板的核心部的顶表面。第一天线图案可以设置在基板的顶表面上，并且电连接到第一半导体芯片。外部端子可以设置在基板的底表面的第一区上，并且第二天线图案可以设置在基板的底表面的第二区上。