Silicon-based three-dimensional integrated transceiving front end

The invention discloses a silicon-based three-dimensional integrated transceiving front end, which comprises a silicon-based antenna radiation layer, an antenna feed network layer, a radio frequency signal vertical transmission layer, a packaging chip module layer and an input/output port layer; the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHI JIANXING, YANG DONGSHENG, ZHOU JUN, SHEN GUOCE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES TRANSMISSION
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