Silicon-based three-dimensional integrated transceiving front end

The invention discloses a silicon-based three-dimensional integrated transceiving front end, which comprises a silicon-based antenna radiation layer, an antenna feed network layer, a radio frequency signal vertical transmission layer, a packaging chip module layer and an input/output port layer; the antenna feed network layer comprises a closed air cavity structure, high-density three-dimensional vertical silicon through holes are integrated in the radio-frequency signal vertical transmission layer, and the radio-frequency signal vertical transmission layer is bonded with the antenna feed network layer through a wafer-level bonding process; a radio frequency transceiving chip, a beam control chip and a power supply modulation chip are integrated in the packaging chip module layer through a FanOut packaging process, and the chips are connected with one another through multi-layer rewiring; and a high-density ball grid array is integrated in the input/output port layer. The antenna, the TSV and the packaging ch