SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

The invention relates to a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes: a chamber part; an operation table part arranged in the cavity part; a rotating shaft part which is rotatably mounted on the operation table part and enables the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BAEK SEUNG-DAE, KIM SEONG-HWA, KIM SUNG-YUP, KIM NAM-JIN, SON JAE-HWAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The invention relates to a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes: a chamber part; an operation table part arranged in the cavity part; a rotating shaft part which is rotatably mounted on the operation table part and enables the substrate placed on the rotating shaft part to rotate; and a drying part which is assembled in the chamber part and is arranged above the substrate so as to supply a drying fluid to the chamber part, so that the working environment of the chamber part can be quickly optimized. 本发明涉及基板处理装置以及基板处理方法。该基板处理装置包括:腔室部;内置于腔室部的操作台部;转轴部,以可旋转方式安装于操作台部并且使放置于转轴部的基板旋转;以及干燥部,组装于腔室部并且配置于基板的上方,以向腔室部供给干燥用流体,从而能够迅速地优化腔室部的作业环境。