Semiconductor plate groove etching method

The invention discloses a semiconductor plate groove etching method, which relates to the technical field of semiconductor processing, and comprises the following steps of: 1, covering photoresist on the surface of a non-etching area to obtain a processing plate; step 2, installing the processing pl...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JIANG ZHENRONG, ZHOU HAISHENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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