Target material assembly and manufacturing method thereof
The invention discloses a target material assembly and a manufacturing method thereof. The target material assembly comprises a target material and a back plate, wherein the back plate is arranged on the periphery of the target material; and the sputtering surface of the target material protrudes re...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a target material assembly and a manufacturing method thereof. The target material assembly comprises a target material and a back plate, wherein the back plate is arranged on the periphery of the target material; and the sputtering surface of the target material protrudes relative to the front end surface of the back plate. According to the target material assembly and the manufacturing method thereof, the back plate is arranged on the periphery of the target material, the back plate does not occupy the back surface of the target material, and the thickness of the sputtering range is completely formed by the target material, so that the target material can be indirectly set to be thicker, the service life of the target material is prolonged, and compared with a conventional product, the target material assembly has the advantages that the combined power can be extended to the end of the service life, and the long service life of the target material assembly is achieved.
本发明公开了一种靶材组件及其 |
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