COMPOSITION FOR FORMING SILICA LAYER, SILICA LAYER FORMED THEREFROM, AND ELECTRONIC DEVICE INCLUDING SILICA LAYER
The present invention provides a composition for forming silica layer, a silica layer formed therefrom, and an electronic device including silica layer. The present invention provides a composition for forming the silica layer including a silicon-containing polymer, and a solvent, wherein the silico...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present invention provides a composition for forming silica layer, a silica layer formed therefrom, and an electronic device including silica layer. The present invention provides a composition for forming the silica layer including a silicon-containing polymer, and a solvent, wherein the silicon-containing polymer has a weight average molecular weight (Mw) of 8,000 g/mol to 15,000 g/mol, and wherein a content of nitrogen atoms of the silicon-containing polymer measured by a kjeldahl titration method is 25 wt % to 30 wt % based on a total weight of the silicon-containing polymer.
本发明提供一种用于形成二氧化硅层的组成物,一种使用所述组成物的二氧化硅层以及包括所述二氧化硅层的电子装置。所述组成物包含含硅聚合物和溶剂,其中含硅聚合物具有约8,000克/摩尔到约15,000克/摩尔的重量平均分子量(Mw),且由凯氏(kjeldahl)滴定法测量的含硅聚合物的氮含量按含硅聚合物的总重量计是约25重量%到约30重量%。 |
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