SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
A semiconductor package includes a carrier having a recess, a semiconductor die arranged on the carrier such that a first side of the semiconductor die faces the carrier, and a contact clip arranged over a second side of the semiconductor die, opposite the first side. The contact clip includes a low...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A semiconductor package includes a carrier having a recess, a semiconductor die arranged on the carrier such that a first side of the semiconductor die faces the carrier, and a contact clip arranged over a second side of the semiconductor die, opposite the first side. The contact clip includes a lowered part. The lowered part is arranged in the recess.
一种半导体封装体包括:包括凹部的载体;半导体裸片,其布置在所述载体上,使得所述半导体裸片的第一侧面对载体;以及接触夹,其布置在所述半导体裸片的与所述第一侧相反的第二侧之上,所述接触夹包括下降部分,其中,所述下降部分布置在所述凹部中。 |
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