Electrostatic chuck and wafer testing method

The invention discloses an electrostatic chuck and a wafer testing method, and the electrostatic chuck comprises: a substrate which is used for bearing a to-be-adsorbed object; an insulating layer which is arranged above the substrate and adsorbs the to-be-adsorbed object through static electricity;...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAN DASHENG, CAI YUYUAN, QIU HAIBIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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