Electrostatic chuck and wafer testing method

The invention discloses an electrostatic chuck and a wafer testing method, and the electrostatic chuck comprises: a substrate which is used for bearing a to-be-adsorbed object; an insulating layer which is arranged above the substrate and adsorbs the to-be-adsorbed object through static electricity; and a conductive part which is arranged in the insulating layer and is in contact with at least partial area of the back surface of the to-be-adsorbed object, wherein the substrate and the insulating layer comprise a plurality of liftable parts which are concentrically arranged. The electrostatic chuck can be suitable for testing wafers of different specifications, the fragment rate of the wafers can be reduced, and meanwhile the utilization rate of a machine table can be improved. 本发明公开了一种静电吸盘及晶圆测试方法，包括：基板，用于承载待吸附物；绝缘层，设置在所述基板的上方，通过静电吸附所述待吸附物；导电部，导电部设置在所述绝缘层中，与所述待吸附物的背面的至少部分区域接触；其中所述基板和所述绝缘层包括同心设置的可升降的多个部分。本发明所述的静电吸盘可以适用于不同规格的晶圆测试，不仅可以降低晶圆的破片率，同时能够提高机台的利用率。