HEATING ARRANGEMENT

The present invention relates to a heating arrangement (1) for heating an air flow, having a circuit board (3) for the energy supply and/or controlling of heating elements (2), and having at least one heating element mounting (5) arranged on the circuit board (3), into which at least one heating ele...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: EDEL NICOLAS, ZAHND AUDREY, STOECKEL JEROME, MAGNIER GILLES, DAUDON GUILLAUME
Format: Patent
Sprache:chi ; eng
Schlagworte:
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