HEATING ARRANGEMENT

The present invention relates to a heating arrangement (1) for heating an air flow, having a circuit board (3) for the energy supply and/or controlling of heating elements (2), and having at least one heating element mounting (5) arranged on the circuit board (3), into which at least one heating element (2) is or can be plugged in at a heating element slot (7) of the heating element mounting (5). The heating element mounting can comprise at least two electrically conductive conductors, each of which is electrically contacted with at least one plugged-in heating element and with the circuit board. It is substantial for the invention that on each conductor (8) an injection moulding (9) is formed through at least partial overmoulding. 本发明涉及一种用于加热空气流的加热装置(1)，其具有用于能量供应和/或控制加热元件(2)的电路板(3)，并且具有布置在电路板(3)上的至少一个加热元件安装件(5)，至少一个加热元件(2)在该加热元件安装件(5)的加热元件插槽(7)处插入到或者能够插入到该加热元件安装件内。加热元件安装件可以包括至少两个导电导体，该导电导体中的每个与至少一个被插入的加热元件以及电路板电接触。对于本发明而言重要的是，在每个导体(8)上都通过至少部分地二次成型来形成注射成型件(9)。