Local electroplating device

The invention provides a local electroplating device capable of performing local electroplating on only one surface of a plated object. The local electroplating device (30) is provided with an electrolyte circulation structure (31) having an electrolyte circulation path therein, and a plated object transporting structure (32) for transporting a plated object (P). The electrolyte circulation path has a slit-shaped window section (317) that opens to the outside of the electrolyte circulation structure (31) between an electrolyte diffusion path (314) and an electrolyte contraction path (315). The plated object transporting structure (32) transports the plated object (P) along the window section (317) while causing a region (a1) on one surface of the plated object (P) to face the window section (317). 本发明提供一种局部电镀装置，其能够仅对被镀物的一面实施局部电镀。局部电镀装置(30)具备：在内部具有电解液循环路径的电解液循环结构体(31)和输送被镀物(P)的被镀物输送结构体(32)。电解液循环路径在电解液扩散路径(314)和电解液收缩路径(315)之间具有向电解液循环结构体(31)的外部开放的狭缝状的窗口部(317)。被镀物输送结构体(32)一边使被镀物(P)的一面的区域(a1)与窗口部(317)相对，一边沿着窗口部(31