Forming method of foam board

The invention belongs to the field of preparation of foam boards, and discloses a forming method of a foam board. The forming method of the foam board comprises the following steps of: (1) preparing a prepreg according to the specification and size of the foam board to be prepared; (2) laying a laye...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YANG JIANBO, YANG YU, TAN ZHIJUN, TAN ZICHENG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention belongs to the field of preparation of foam boards, and discloses a forming method of a foam board. The forming method of the foam board comprises the following steps of: (1) preparing a prepreg according to the specification and size of the foam board to be prepared; (2) laying a layer of release film on the inner surface of a mold with an air bag and air holes in advance, and then forming a foaming cavity; (3) heating and pressurizing the mold obtained in the step (2); (4) cooling, deflating and opening the mold, and closing the whole mold after the air bag is removed; and (5) preparing resin foaming mixed slurry, injecting the resin foaming mixed slurry into the foaming cavity in the mold until the foaming cavity is full, carrying out heat-preservation and pressure-preservation foaming, and opening the mold to obtain the foam board. According to the forming method of the foam board, post-treatment procedures are reduced, and the phenomenon of layering caused by infirm bonding basically does n