PCB cutting path early warning method and device
The invention discloses a PCB cutting path early warning method and device. The method comprises the steps that size information and shape information of a first target PCB are obtained; the size information and the shape information are input into a first PCB dividing machine, and a first preset PC...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a PCB cutting path early warning method and device. The method comprises the steps that size information and shape information of a first target PCB are obtained; the size information and the shape information are input into a first PCB dividing machine, and a first preset PCB cutting path is obtained; a first image is obtained, the first image is compared with a first preset PCB cutting path, and a first path deviation index is obtained; when the first path deviation index does not meet a first path deviation index threshold value, a second image is obtained, the first image, the second image and a first preset PCB cutting path are input into a path feature comparison model, and a first path deviation trend prediction result is obtained; and early warning is performed according to the first path deviation trend prediction result. The technical problems that in the prior art, in the PCB cutting process, path judgment and early warning are lacked in the cutting process, or early warning |
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