METHOD FOR PRODUCING CONNECTING STRUCTURE, CONNECTING STRUCTURE, FILM STRUCTURE, AND METHOD FOR PRODUCING FILM STRUCTURE

Provided are: a method for producing connecting structure, connecting structure, film structure, and method for producing film structure, with which it is possible to mount electronic components having a plurality of rows of terminals on a mounting surface, using existing facilities. The present inv...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SUZUKI MANABU, TANAKA YUSUKE, KAMATA YUSUKE, NAMIKI HIDEJI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:Provided are: a method for producing connecting structure, connecting structure, film structure, and method for producing film structure, with which it is possible to mount electronic components having a plurality of rows of terminals on a mounting surface, using existing facilities. The present invention comprises: an affixing step in which connecting films (22) and (23) having a unit area of a predetermined length 21L in the length direction of the substrate (21) and a predetermined width 21W in the width direction of the substrate (21) from a film structure comprising a tape-form substrate (21) and a connecting film formed on the substrate (21) are affixed to a second electronic component or a first electronic component having a plurality of rows of terminals; and a connecting step in which, via connecting films (22) and (23), a terminal of a first electronic component and a terminal of a second electronic component are connected, and the film structure has a non-affixed area to which the connecting film i