package structure and method for forming the same

An exemplary structure includes a first semiconductor device bonded to a first side of the first redistribution structure through a first conductive connection; the first semiconductor device comprising a first plurality of passive elements formed on the first substrate, the first redistribution str...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHOU MENGWEI, CHEN SHUOMAO, WENG DEQI, ZHUANG BOYAO, ZHENG XINPU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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