RESIN COMPOSITION AND MOLDED BODY

RESIN COMPOSITION AND MOLDED BODY

This resin composition comprises: a polyamide resin (A); an ionomer (B) of an ethylene-unsaturated carboxylic acid-based copolymer; and an ethylene-based polymer (C), wherein the content of the polyamide resin (A) is at least 50 mass% with respect to the total amount of the polyamide resin (A), the...

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Hauptverfasser: YAMAMOTO SADAKI, OKI KAZUYUKI, ICHINOSEKI CHIKARA, SHIMIZU TAKAHIRO
Format: Patent
Sprache:chi ; eng
Schlagworte:
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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creator YAMAMOTO SADAKI
OKI KAZUYUKI
ICHINOSEKI CHIKARA
SHIMIZU TAKAHIRO
description This resin composition comprises: a polyamide resin (A); an ionomer (B) of an ethylene-unsaturated carboxylic acid-based copolymer; and an ethylene-based polymer (C), wherein the content of the polyamide resin (A) is at least 50 mass% with respect to the total amount of the polyamide resin (A), the ionomer (B) of the ethylene-unsaturated carboxylic acid-based copolymer, and the ethylene-based polymer (C), and the content of the ethylene-based polymer (C) is less than 50 mass% with respect to the total amount of the ionomer (B) of the ethylene-unsaturated carboxylic acid-based copolymer and the ethylene-based polymer (C). 树脂组合物含有聚酰胺树脂(A)、乙烯·不饱和羧酸系共聚物的离子交联聚合物(B)、和乙烯系聚合物(C)，相对于前述聚酰胺树脂(A)、前述乙烯·不饱和羧酸系共聚物的离子交联聚合物(B)、及前述乙烯系聚合物(C)的总量而言，前述聚酰胺树脂(A)的含有率为50质量％以上，相对于前述乙烯·不饱和羧酸系共聚物的离子交联聚合物(B)及前述乙烯系聚合物(C)的总量而言，前述乙烯系聚合物(C)的含有率小于50质量％。
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OKI KAZUYUKI ; ICHINOSEKI CHIKARA ; SHIMIZU TAKAHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN113454156A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMAMOTO SADAKI</creatorcontrib><creatorcontrib>OKI KAZUYUKI</creatorcontrib><creatorcontrib>ICHINOSEKI CHIKARA</creatorcontrib><creatorcontrib>SHIMIZU TAKAHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAMAMOTO SADAKI</au><au>OKI KAZUYUKI</au><au>ICHINOSEKI CHIKARA</au><au>SHIMIZU TAKAHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RESIN COMPOSITION AND MOLDED BODY</title><date>2021-09-28</date><risdate>2021</risdate><abstract>This resin composition comprises: a polyamide resin (A); an ionomer (B) of an ethylene-unsaturated carboxylic acid-based copolymer; and an ethylene-based polymer (C), wherein the content of the polyamide resin (A) is at least 50 mass% with respect to the total amount of the polyamide resin (A), the ionomer (B) of the ethylene-unsaturated carboxylic acid-based copolymer, and the ethylene-based polymer (C), and the content of the ethylene-based polymer (C) is less than 50 mass% with respect to the total amount of the ionomer (B) of the ethylene-unsaturated carboxylic acid-based copolymer and the ethylene-based polymer (C). 树脂组合物含有聚酰胺树脂(A)、乙烯·不饱和羧酸系共聚物的离子交联聚合物(B)、和乙烯系聚合物(C)，相对于前述聚酰胺树脂(A)、前述乙烯·不饱和羧酸系共聚物的离子交联聚合物(B)、及前述乙烯系聚合物(C)的总量而言，前述聚酰胺树脂(A)的含有率为50质量％以上，相对于前述乙烯·不饱和羧酸系共聚物的离子交联聚合物(B)及前述乙烯系聚合物(C)的总量而言，前述乙烯系聚合物(C)的含有率小于50质量％。</abstract><oa>free_for_read</oa></addata></record>
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subjects CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
title RESIN COMPOSITION AND MOLDED BODY
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