RESIN COMPOSITION AND MOLDED BODY

This resin composition comprises: a polyamide resin (A); an ionomer (B) of an ethylene-unsaturated carboxylic acid-based copolymer; and an ethylene-based polymer (C), wherein the content of the polyamide resin (A) is at least 50 mass% with respect to the total amount of the polyamide resin (A), the ionomer (B) of the ethylene-unsaturated carboxylic acid-based copolymer, and the ethylene-based polymer (C), and the content of the ethylene-based polymer (C) is less than 50 mass% with respect to the total amount of the ionomer (B) of the ethylene-unsaturated carboxylic acid-based copolymer and the ethylene-based polymer (C). 树脂组合物含有聚酰胺树脂(A)、乙烯·不饱和羧酸系共聚物的离子交联聚合物(B)、和乙烯系聚合物(C)，相对于前述聚酰胺树脂(A)、前述乙烯·不饱和羧酸系共聚物的离子交联聚合物(B)、及前述乙烯系聚合物(C)的总量而言，前述聚酰胺树脂(A)的含有率为50质量％以上，相对于前述乙烯·不饱和羧酸系共聚物的离子交联聚合物(B)及前述乙烯系聚合物(C)的总量而言，前述乙烯系聚合物(C)的含有率小于50质量％。