METHOD FOR PRODUCING A COOLING BODY FOR AN ELECTRONIC COMPONENT

The invention relates to a method for producing a cooling body (10) for an electronic component, comprising the steps of: providing a first sheet metal section (122) having a thickness of 1 to 5 mm, said first sheet metal section being made of copper or an alloy containing mainly copper; providing a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	RANG OLIVER, PRIES MARCEL, MULLER JENS UWE, SCHOCHOW ECKHARD
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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