METHOD FOR PRODUCING A COOLING BODY FOR AN ELECTRONIC COMPONENT

The invention relates to a method for producing a cooling body (10) for an electronic component, comprising the steps of: providing a first sheet metal section (122) having a thickness of 1 to 5 mm, said first sheet metal section being made of copper or an alloy containing mainly copper; providing a...

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Bibliographische Detailangaben
Hauptverfasser:	RANG OLIVER, PRIES MARCEL, MULLER JENS UWE, SCHOCHOW ECKHARD
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The invention relates to a method for producing a cooling body (10) for an electronic component, comprising the steps of: providing a first sheet metal section (122) having a thickness of 1 to 5 mm, said first sheet metal section being made of copper or an alloy containing mainly copper; providing a second sheet metal section (121) of at least the same thickness, said second sheet metal section consisting of aluminum or an alloy containing mainly aluminum; stacking the two sheet metal sections (121, 122) concentrically on top of each other to form a sheet metal stack (12); and shaping the sheet metal stack (12) by means of a cold stamping method into a cooling body (10) having a flat upper side (18) and a profile-containing lower side forming the cooling structure (14), wherein the upper side (18) is made of the material of the first sheet metal section (122) with an edge (181) made of the material of the second sheet metal section (121), and the lower side is entirely made of the material of the second sheet