SOLDER COMPOSITION FOR LASER WELDING, ELECTRONIC SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC SUBSTRATE

The invention provides a solder composition for laser welding, which contains a solder composition and (E) welding powder. The solder composition contains a flux composition containing (A) a rosin-based resin, (B) an activator, (C) a solvent, and (D) a thixotropic agent, the component (A) containing...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MIZUNO TAKEMI, YOSHIZAWA SHINJI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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