SOLDER COMPOSITION FOR LASER WELDING, ELECTRONIC SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC SUBSTRATE

The invention provides a solder composition for laser welding, which contains a solder composition and (E) welding powder. The solder composition contains a flux composition containing (A) a rosin-based resin, (B) an activator, (C) a solvent, and (D) a thixotropic agent, the component (A) containing...

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Bibliographische Detailangaben
Hauptverfasser:	MIZUNO TAKEMI, YOSHIZAWA SHINJI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The invention provides a solder composition for laser welding, which contains a solder composition and (E) welding powder. The solder composition contains a flux composition containing (A) a rosin-based resin, (B) an activator, (C) a solvent, and (D) a thixotropic agent, the component (A) containing (A1) a polymerized rosin having a softening point of 130 DEG C or more and an acid value of 200 mgKOH/g or less, and the component (C) containing (C1) a dialkyl sebacate. 本发明的激光焊接用焊料组合物含有焊剂组合物和(E)焊料粉末，所述焊剂组合物含有(A)松香类树脂、(B)活化剂、(C)溶剂及(D)触变剂，其中，所述(A)成分含有(A1)软化点为130℃以上、且酸值为200mgKOH/g以下的聚合松香，所述(C)成分含有(C1)癸二酸二烷基酯。