High-speed sub-connector

The invention discloses a high-speed sub-connector, which comprises a plurality of wafers distributed in parallel. A signal terminal on each wafer comprises a contact end, a terminal body and a crimping end, the contact end and the terminal body of the signal terminal are in a wide side coupling form, and the crimping end is in a narrow side coupling form. The wide-side coupled crimping end is converted into the narrow-side coupled crimping end, so that the problem that the terminal occupies too large area of a circuit board due to the left-right arrangement of the terminal is overcome, and the high-density integration of the connector is further improved. 本发明公开一种高速子连接器，包括并行分布的多个晶片，每个晶片上的信号端子均包括触头端、端子体以及压接端，该信号端子的触头端和端子体呈宽边耦合的形式，压接端呈窄边耦合的形式。本发明将宽边耦合的压接端转化为了窄边耦合的压接端形式，从而克服了由于端子的左右排布造成的端子占电路板面积过大的问题，从而进一步提升了连接器的高密度集成化。