Sensor chip packaging structure for spaceflight and preparation method
The invention belongs to the technical field of packaging of spaceflight detection equipment, and particularly relates to a sensor chip packaging structure for spaceflight and a preparation method, and the sensor chip packaging structure comprises an upper-layer packaging shell (21), a middle-layer...
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| creator | CHENG LIHUI WANG CHUNQIN SUN YUEQIANG ZHANG WANCHANG SHEN GUOHONG SUN LIANG SHEN DONGMEI SUN JIANGHUAN SUN YING JING TAO CAO XUELEI ZHANG SHENYI |
| description | The invention belongs to the technical field of packaging of spaceflight detection equipment, and particularly relates to a sensor chip packaging structure for spaceflight and a preparation method, and the sensor chip packaging structure comprises an upper-layer packaging shell (21), a middle-layer packaging shell (22), a lower-layer packaging shell (23) and a sensor chip (24). A three-layer square structure which is longitudinally stacked is arranged among the upper-layer packaging shell (21), the middle-layer packaging shell (22) and the lower-layer packaging shell (23). The sensor chip (24) is arranged in the middle-layer packaging shell (22), a sensitive area of the sensor chip (24) faces a square hole formed in the middle of the middle-layer packaging shell (22), the sensitive area of the sensor chip (24) is exposed through the square hole formed in the middle-layer packaging shell (22), and particles to be detected directly act on the sensitive area of the sensor chip (24). The structure of an upper PCB |
| format | Patent |
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A three-layer square structure which is longitudinally stacked is arranged among the upper-layer packaging shell (21), the middle-layer packaging shell (22) and the lower-layer packaging shell (23). The sensor chip (24) is arranged in the middle-layer packaging shell (22), a sensitive area of the sensor chip (24) faces a square hole formed in the middle of the middle-layer packaging shell (22), the sensitive area of the sensor chip (24) is exposed through the square hole formed in the middle-layer packaging shell (22), and particles to be detected directly act on the sensitive area of the sensor chip (24). 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A three-layer square structure which is longitudinally stacked is arranged among the upper-layer packaging shell (21), the middle-layer packaging shell (22) and the lower-layer packaging shell (23). The sensor chip (24) is arranged in the middle-layer packaging shell (22), a sensitive area of the sensor chip (24) faces a square hole formed in the middle of the middle-layer packaging shell (22), the sensitive area of the sensor chip (24) is exposed through the square hole formed in the middle-layer packaging shell (22), and particles to be detected directly act on the sensitive area of the sensor chip (24). 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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Sensor chip packaging structure for spaceflight and preparation method |
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