Sensor chip packaging structure for spaceflight and preparation method

The invention belongs to the technical field of packaging of spaceflight detection equipment, and particularly relates to a sensor chip packaging structure for spaceflight and a preparation method, and the sensor chip packaging structure comprises an upper-layer packaging shell (21), a middle-layer packaging shell (22), a lower-layer packaging shell (23) and a sensor chip (24). A three-layer square structure which is longitudinally stacked is arranged among the upper-layer packaging shell (21), the middle-layer packaging shell (22) and the lower-layer packaging shell (23). The sensor chip (24) is arranged in the middle-layer packaging shell (22), a sensitive area of the sensor chip (24) faces a square hole formed in the middle of the middle-layer packaging shell (22), the sensitive area of the sensor chip (24) is exposed through the square hole formed in the middle-layer packaging shell (22), and particles to be detected directly act on the sensitive area of the sensor chip (24). The structure of an upper PCB