SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE

A semiconductor package is disclosed. The semiconductor package comprises a semiconductor chip, a molded body encapsulating the semiconductor chip and comprising a top face and an opposing bottom face and four side faces connecting the top and bottom faces, and a plurality of electrical contacts arranged on two of the side faces of the molded body, wherein the other two side faces are metal-free side faces, and wherein the molded body comprises a cut surface at no more than one of the side faces. 一种半导体封装，包括：半导体芯片；模制体，封装半导体芯片，并且包括顶面和相对的底面以及连接顶面和底面的四个侧面；以及多个电触点，布置在模制体的侧面中的两个侧面上，其中，另两个侧面是无金属侧面，并且其中，模制体在侧面中的不多于一个侧面处包括切割表面。