Composite curing agent, adhesive, conductive adhesive and preparation method and application thereof

The invention discloses a composite curing agent, an adhesive, a conductive adhesive and a preparation method and application thereof. The composite curing agent comprises 0.1-1 part of an epoxy resin curing agent, 0.1-0.5 part of an A1 curing agent, 0.1-1 part of an A2 curing agent, 0.1-0.5 part of an A3 curing agent and 0.1-1 part of an A4 curing agent, and the A1-type curing agent, the A2-type curing agent, the A3-type curing agent and the A4-type curing agent are described in the specification. The curing agent can be kept stable at room temperature and does not generate curing cross-linking for a long time, and the minimum filling aperture can reach 0.3 mm; the conductive adhesive film coated with the curing agent can be stored for more than 3 months at room temperature, and the conductive adhesive adopting the curing agent has excellent adhesive property, moisture and heat resistance and processability. 本发明公开了一种复合型固化剂、胶黏剂、导电胶及其制备方法、应用。该复合型固化剂包括环氧树脂固化剂0.1～1份、A1类固化剂0.1～0.5份、A2类固化剂0.1～1份、A3类固化剂0.1～0.5份和A4类