Novel two-frame waste removing die-cutting machine and using method thereof
The invention discloses a novel two-frame waste removing die-cutting machine and a using method thereof, and relates to the technical field of packaging and printing. The novel two-frame waste removing die-cutting machine comprises a rack, a first waste removing mechanism and a second waste removing...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a novel two-frame waste removing die-cutting machine and a using method thereof, and relates to the technical field of packaging and printing. The novel two-frame waste removing die-cutting machine comprises a rack, a first waste removing mechanism and a second waste removing mechanism, a waste removing portal frame and a waste removing supporting column are sequentially fixed to the top of the rack in the material conveying direction, the first waste removing mechanism is arranged on the waste removing portal frame, a first lower die plate is arranged under the first waste removing mechanism, the second waste removing mechanism is arranged on the waste removing supporting column, and a second lower die plate is arranged under the second waste removing mechanism. Primary waste removing is conducted through the first waste removing mechanism, then camera shooting is conducted through a camera, whether waste removing of each die cutting position is completed or not is judged, the second |
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