METHOD FOR OBTAINING INFORMATION ABOUT A LAYER OF AN ORGANIC SOLDERABILITY PRESERVATIVE ON A PRINTED CIRCUIT BOARD

A method for obtaining information about a layer of an organic solderability preservative, OSP, on a printed circuit board, PCB. The method comprises steps that: a PCB (16) having a copper layer (18) is provided, wherein a solder resist (19) is placed on the copper layer (18), the solder resist (19) has openings (21), and in the openings (21), a copper surface of the copper layer (18) is covered by a layer of an OSP; a fluorescence measuring system (10) is provided, comprising a radiation source (11), a detection unit (12), and a movement device (24). The method comprises: a) obtaining (S2) information about the location of the openings (21) on the PCB (16), b) selecting (S3) at least one of the openings (21), c) placing (S4) the radiation source (11) at such position that the radiation beam (22) irradiates into the at least one selected opening (21) on the layer of the OSP (20), and d) detecting (S5) the fluorescent radiation (23) emitted from the OSP (20). 本发明涉及一种用于在印刷电路板PCB上得到有关有机可焊性保护OSP层的信息的方法，所述方法包括：提供具