APPARATUS FOR PROCESSING COPPER SURFACE

The purpose of the present invention is to provide a novel apparatus for processing a copper surface. The processing apparatus according to the present invention is an apparatus for processing a copper-coated surface of an article, the apparatus comprising: a first bath for oxidizing the surface; an...

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Bibliographische Detailangaben
Hauptverfasser:	KOKAJI YOSHINOBU, SATO MAKIKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The purpose of the present invention is to provide a novel apparatus for processing a copper surface. The processing apparatus according to the present invention is an apparatus for processing a copper-coated surface of an article, the apparatus comprising: a first bath for oxidizing the surface; and a second bath for performing electroplating treatment on the oxidized surface. 本发明的目的在于提供一种新型的铜表面的加工装置。本发明的加工装置是针对具有被铜覆盖的表面的物体的上述表面的加工装置，该加工装置具有用于将上述表面氧化的第一槽、和用于对经过氧化的上述表面进行电镀处理的第二槽。