PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

The present invention relates to a photosensitive resin composition which contains a binder polymer, a photopolymerizable compound and a photopolymerization initiator. The binder polymer contains a structural unit derived from a (meth)acrylate compound having a dicyclopentanyl group. 本发明涉及一种感光性树脂组合物...

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Bibliographische Detailangaben
Hauptverfasser:	KURODA AYAKA, SUNOHARA SEIJI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention relates to a photosensitive resin composition which contains a binder polymer, a photopolymerizable compound and a photopolymerization initiator. The binder polymer contains a structural unit derived from a (meth)acrylate compound having a dicyclopentanyl group. 本发明涉及一种感光性树脂组合物，其含有粘合剂聚合物、光聚合性化合物及光聚合引发剂，其中，粘合剂聚合物包含源自具有双环戊基的(甲基)丙烯酸酯化合物的结构单元。