Semiconductor device and method

The invention relates to a semiconductor device and a method. A semiconductor device and a method of manufacturing the same are provided that facilitate supporting a contact when removing a material to form an air gap. In an embodiment, the contact is formed with an enlarged base to assist in supporting an overlying portion of the contact. In other embodiments, a stent material may also be placed prior to forming the air gap in order to provide additional support. 本公开涉及半导体器件和方法。提供了一种半导体器件及其制造方法，其有助于在移除材料以形成气隙时支撑接触件。在实施例中，接触件被形成有扩大的基部以辅助支撑接触件的上覆部分。在其他实施例中，也可以在形成气隙之前放置支架材料以便提供附加支撑。