Cutting mechanism for PCB substrate

The invention discloses a cutting mechanism for a PCB substrate. The mechanism comprises a base and a cutting device, wherein the cutting device is slidably connected to the upper portion of the base, placing frames are symmetrically and fixedly mounted on one side of the top of the base, a mounting box is fixedly mounted at the position, between the two placing frames, of the top of the base, a horizontal driving device is mounted in the mounting box, a sliding plate is slidably connected into the mounting box, electric push rods are symmetrically and fixedly mounted on one side of the top of the sliding plate, sliding blocks are symmetrically and slidably connected to two sides of the sliding plate, electric suction cups are fixedly mounted at the output ends of the electric push rods and the top ends of the sliding blocks, and an ejection mechanism is arranged at the bottom of the sliding plate. According to the cutting device, the second motor is adjusted to drive the elastic mechanism to move to the edge