PROTECTIVE MATERIAL FOR ELECTRONIC CIRCUIT, SEALANT FOR PROTECTIVE MATERIAL FOR ELECTRONIC CIRCUIT, SEALING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

An electronic circuit protection material satisfies at least one of the following (1) and (2). (1) An electronic circuit protection material contains a resin component and an inorganic filler, and the content of the inorganic filler is 50 mass% or more of the whole. (2) An electronic circuit protect...

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Bibliographische Detailangaben
Hauptverfasser: HORI HIROSHI, ISHIBASHI KENTA, YAMAURA ITARU, KANG DONGOL
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:An electronic circuit protection material satisfies at least one of the following (1) and (2). (1) An electronic circuit protection material contains a resin component and an inorganic filler, and the content of the inorganic filler is 50 mass% or more of the whole. (2) An electronic circuit protection material which contains a resin component and an inorganic filler, the viscosity (Pa*s) measured under the conditions of 75 DEG C and a shear rate of 5s-1 is set to viscosity A, and, when the viscosity (Pa*s) measured under the conditions of 75 DEG C and a shear rate of 50 s-1 is set to viscosity B, the thixotropic index at 75 DEG C obtained as the value of viscosity A/viscosity B is 0.1 to 2.5. 一种电子电路保护材料,其满足下述(1)或(2)中的至少任一者。(1)一种电子电路保护材料,其含有树脂成分和无机填充材料,上述无机填充材料的含有率为整体的50质量%以上。(2)一种电子电路保护材料,其含有树脂成分和无机填充材料,在将75℃、剪切速度5s-1的条件下所测定的粘度(Pa·s)设为粘度A,且将75℃、剪切速度50s-1的条件下所测定的粘度(Pa·s)设为粘度B时,作为粘度A/粘度B的值而得到的75℃下的触变指数为0.1~2.5。