Manufacturing method of package

The embodiment of the invention provides a package and a manufacturing method of the package. The method includes bonding a first device die with a second device die. The second device die is over the first device die. A bonding structure is formed in a combined structure including the first device die and the second device die. An assembly is formed in the combined structure and includes passive devices or transmission lines. The method also comprises forming first and second electrical connections electrically coupled to the first and second ends of the assembly. 本公开实施例提供封装及封装的制作方法。所述方法包括对第一器件管芯与第二器件管芯进行结合。第二器件管芯位于第一器件管芯之上。在包括第一器件管芯及第二器件管芯的组合结构中形成结合结构。在结合结构中形成组件。组件包括无源器件或传输线。所述方法还包括形成电耦合到组件的第一端及第二端的第一电连接件及第二电连接件。