SEMICONDUCTOR MODULE, TEMPERATURE CONTROL SYSTEM INCLUDING THE SAME, AND TEMPERATURE CONTROL METHOD

A semiconductor module includes a substrate, a semiconductor package disposed over the substrate, a Peltier element disposed over the semiconductor package and having a heat absorbing portion and a heat generating portion, the heat absorbing portion being adjacent to the semiconductor package and the heat generating portion being adjacent to a cooling element, and a cooling element disposed over the Peltier element. 一种半导体模块包括：衬底；半导体封装件，其设置在衬底之上；珀尔帖元件，其设置在半导体封装体之上，并且具有吸热部和发热部，所述吸热部与半导体封装件相邻，所述发热部与冷却元件相邻；以及冷却元件，其设置在珀尔帖元件之上。